TLP173A 2009-12-22 1 toshiba photocoupler photorelay TLP173A telecommunications control equipment data acquisition system security equipment measurement equipment the toshiba TLP173A consists of a gallium arsenide infrared emitting diode optically coupled to a photo-mosfet in a mfsop6 package. this photorelay requires 2ma of led cu rrent to turn it on. it is suitable for applications that need electrical power savings. ? 4-pin sop (mfsop6): height = 2.5 mm, pitch = 2.54 mm ? normally open (1-form-a) device ? peak off-state voltage: 60 v (min) ? trigger led current: 2 ma (max) ? on-state current: 70 ma (max) ? on-state resistance: 50 ? (max) ? isolation voltage: 3750 vrms (min) ? ul (pending approval) : ul1577, file no.e67349 ? c-ul (pending approval) csa component acceptance service no. 5a file no.e67349 ? bsi (pending approval): ? semko (pending approval): ? option (v4) type vde (pending approval): maximum operating insulation voltage: 565vpk highest permissible over voltage: 6000vpk pin configuration (top view) internal circuit unit: mm jedec D jeita D toshiba 11-4c1 weight: 0.09 g (typ.) 1 3 6 4 1: anode 3: cathode 4: drain 6: drain 1 3 6 4
TLP173A 2009-12-22 2 absolute maximum rating (ta = 25c) characteristics symbol rating unit forward current i f 50 ma forward current derating (ta 25c) i f /c ?0.5 ma/c reverse voltage v r 5 v pulse forward current (100 s pulse, 100 pps) i fp 1 a led junction temperature t j 125 c off-state output terminal voltage v off 60 v on-state current i on 70 ma forward current derating (ta 25c) i on /c ?0.7 ma/c detector junction temperature t j 125 c storage temperature t stg ? 55 to 125 c operating temperature t opr ? 40 to 85 c lead soldering temperature (10 s) t sol 260 c isolation voltage (ac, 1 min, r.h. 60%) (note 1) bv s 3750 vrms note: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this pr oduct to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and indi vidual reliability data (i.e. reliability test report and estimated failure rate, etc). note: this product is more sensitive than conventional products to electrostatic discharge (esd). it is therefore all the more necessary to observe general precautions regarding esd when handling this component. note 1: led pins are shorted together. detector pins are also shorted together. recommended operating conditions characteristics symbol min typ. max unit supply voltage v dd ? ? 48 v forward current i f ? 3 25 ma on-state current i on ? ? 60 ma operating temperature t opr ?20 ? 65 c note: recommended operating conditions are given as a design guideline to obtain expected performance of the device. additionally, each item is an independent guide line respectively. in developing designs using this product, please confirm specified characteristics shown in this document. electrical characteristics (ta = 25c) characteristics symbol test condition min typ. max unit forward voltage v f i f = 10 ma 1.0 1.15 1.3 v reverse current i r v r = 5 v ? ? 10 a led capacitance c t v = 0, f = 1 mhz ? 30 ? pf off-state current i off v off = 60 v ? 1 1000 na detector capacitance c off v off = 0, f = 1 mhz ? 10 ? pf
TLP173A 2009-12-22 3 coupled electrical characteristics (ta = 25c) characteristics symbol test condition min typ. max unit trigger led current i ft i on = 70 ma ? 0.6 2 ma return led current i fc i off = 100 a 0.1 ? ? ma on-state resistance r on i on = 70 ma, i f = 3 ma ? 25 50 isolation characteristics (ta = 25c) characteristics symbol test condition min typ. max unit capacitance input to output c s v s = 0 v, f = 1 mhz ? 0.4 ? pf isolation resistance r s v s = 500 v, r.h. . 60% 5 10 10 10 14 ? ac, 1 min 3750 ? ? ac, 1 s, in oil ? 10000 ? vrms isolation voltage bv s dc, 1 min, in oil ? 10000 ? vdc switching characteristics (ta = 25c) characteristics symbol test condition min typ. max unit turn-on time t on r l = 200 (note.2) v dd = 10 v, i f = 3 ma ? 1.0 5.0 turn-off time t off r l = 200 (note.2) v dd = 10 v, i f = 3 ma ? 0.5 5.0 ms note 2: switching time test circuit 6 t off t on 10% 90% v out 1 v out r l 4 3 i f i f v dd
TLP173A 2009-12-22 4 i f ta i on ta allowable forward current if (ma) 0 10 20 30 40 50 60 -40 -20 0 20 40 60 80 100 0 allowable on-sate current ion (ma) 0 10 20 30 40 50 60 70 80 -40 -20 0 20 40 60 80 100 ambient temperature ta ( c) ambient temperature ta ( c) i f v f i on v on forward current i f (ma) 0.1 1 10 100 0.8 0.9 1.0 1.1 1.2 1.3 1.4 ta = 25 allowable on-sate current ion (ma) -80 -60 -40 -20 0 20 40 60 80 -2 -1 0 1 2 ta = 25 if = 3ma forward voltage v f (v) on-sate voltage v on (v) r on ta i ft ta on-sate resistance ron ( ? ) 0 10 20 30 -40 -20 0 20 40 60 80 100 if = 3ma ion = 70ma trigger led current i ft (ma) 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 -40 -20 0 20 40 60 80 100 0 ion = 70ma ambient temperature ta ( c) ambient temperature ta ( c) *: the above graphs show typical characteristics.
TLP173A 2009-12-22 5 t on ,t off i f t on ,t off ta switching time t on ,t off (ms) 0.01 0.1 1 10 0.1 1 10 100 vdd = 10v rl = 200 ta = 25 switching time t on ,t off (ms) 0.1 1 10 -40 -20 0 20 40 60 80 100 if = 3ma vdd = 10v rl = 200 forward current i f (ma) ambient temperature ta ( c) i off ta off-state current i off (na) 0.001 0.01 0.1 1 10 -40 -20 0 20 40 60 80 100 v off = 60v ambient temperature ta ( c) *: the above graphs show typical characteristics. t on t off t on t off
TLP173A 2009-12-22 6 precautions about the soldering of the smd type photocoupler types TLP173A(f) mounting method 1) using solder reflow ? temperature profile example of lead (pb) solder ? temperature profile example of using lead (pb-free) solder ? the use of the reflow is to twice. ? in case of second reflow soldering should be performed within 2 weeks of the first reflow under the above conditions. 2) using solder flow (for lead (pb) solder, or lead (pd)-free solder) ? please preheat is at 150c between 60 and 120 seconds. ? complete soldering within 10 seconds below 260c. each pin may be heated at most once. ? the use of the reflow is to once. 3) using a soldering iron ? complete soldering within 10 seconds below 260c, or within 3 seconds at 350c. each pin may be heated at most once. time (s) (c) 240 210 160 60 120s less than 30s package surface temperature 140 time (s) (c) 260 230 190 60 120s 30 50s 180 package surface temperature
TLP173A 2009-12-22 7 specification for embossed-tape packing (tp) for mini-flat coupler 1. applicable package package product type mf-sop6 mini-flat coupler 2. product naming system type of package used for shipment is denoted by a symbol suffix after a product number. the method of classification is as below. example ??a ? [[g]]/rohs compatible(note 3) tape type device name 3. tape dimensions 3.1 specification classification are as shown in table 1 3.2 orientation of device in relation to direction of tape movement device orientation in the recesses is as shown in figure 1. figure device orientation
TLP173A 2009-12-22 8 3.3 empty device recesses are as shown in table 2. table 2 empty device recesses standard remarks occurrences of 2 or more successive empty device recesses 0 within any given 40-mm section of tape, not including leader and trailer single empty device recesses 6 device (max.) per reel not including leader and trailer 3.4 start and end of tape the start of the tape has 50 or more empty holes. the end of tape has 50 or more empty holes and two empty turns only a cover tape. 3.5 tape specification (1) tape material: plastic (protection against electrostatics) (2) dimensions: the tape dimensions are as shown in figure 2 and table 3. figure 2 tape forms table 3 tape dimensions unit: mm unless otherwise specified: 0.1 symbol dimension remark a 4.2 D b 7.6 D d 5.5 center line of indented square hole and sprocket hole e 1.75 distance between tape edge and hole center f 8.0 cumulative error (max.) per 10 feed holes g 4.0 cumulative error (max.) per 10 feed holes k 0 2.8 internal space +0.1 -0.3 +0.1 -0.3 0.3 0.05 3.15 0.2 k 0 g f 1.6 0.1 a e d b 12.0 0.3 1.5 + 0.1 ? 0
TLP173A 2009-12-22 9 3.6 reel (1) material: plastic (2) dimensions: the reel dimensions are as shown in figure 3 and table 4. figure 3 reel form 4. packing either one reel or five reels of photoc oupler are packed in a shipping carton. 5. label indication the carton bears a label indicating the product nu mber, the symbol representing classification of standard, the quantity, the lot num ber and the toshiba company name. 6. ordering method when placing an order, plea se specify the product number, the tape type and the quantity as shown in the following example. example note 3 : please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of product. rohs is the direc tive 2002/95/ec of the european parlia ment and of the council of 27 january 2003 on the restriction of t he use of certain hazardous substances in electrical and electronics equipment. symbol dimension a 380 2 b 80 1 c 13 0.5 e 2.0 0.5 u 4.0 0.5 w1 13.5 0.5 w2 17.5 1.0 e w1 w2 a b c u unit: mm table 4 reel dimensions TLP173A (tpl,f) 3000 pcs device name tape type quantity (must be a multiple of 3000) [[g]]/rohs compatible(note 3)
TLP173A 2009-12-22 10 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the ?toshiba semiconductor reliability handbook? and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? a bsent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? gaas (gallium arsenide) is used in product. gaas is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose gaas in product. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.
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